Field dependence of TDDB lifetime activation energy in copper interconnects

We apply the charge transport model to simulate the TDDB lifetime activation energies (E_a,eV) in copper interconnects. The model very accurately predicts the available activation energy data, in actual interconnect test structures, over a wide range of electric fields. The importance of the induced dipole energy term in influencing breakdown is highlighted by the close match of the experiment and theory. The model can be applied to determine the reliable operating voltage for a given operating temperature.