Title :
Measurement of piezoelectric material´s surface acoustic wave electromechanical coupling cofficient by delay lines
Author :
CHEN, Xiao-yang ; FAN, Zi-kun ; ZHANG, Hui
Author_Institution :
Beijing Changfeng SAW Co. Ltd., Beijing
Abstract :
The surface acoustic wave electromechanical coupling coefficient Ks 2 of piezoelectric material expresses the energy exchange efficiency of surface acoustic wave and electrical field. It is also a significant parameter for development of piezoelectric material and surface acoustic wave devices design and fabrication. Two kinds pattern of double delay lines were designed. The first is a surface acoustic wave double delay lines with free surface, in order to calculate Vf. The second is a surface acoustic wave double delay lines with metallized surface, in order to calculate Vm. Both of the delay lines were fabricated on the same wafer, then sampling some devices for delay time measurement by Agilent E5062A vector network analyzer. The average of Vf and Vm were calculated respectively. The Ks 2 was calculated using above-mentioned formula. The test and calculation were completed with 128deg Y-X LiNbO3, 6deg Y-X LiNbO3, Y-Z LiNbO3 and X-112deg YLiTaO3, 36deg Y-X LiTaO3 respectively. The results accord with Sadao measure´s results in the materials integration.
Keywords :
lithium compounds; piezoelectric materials; piezoelectricity; surface acoustic wave delay lines; surface acoustic waves; yttrium compounds; Agilent E5062A vector network analyzer; LiNbO3; YLiTaO3; electromechanical coupling coefficient; energy exchange efficiency; free surface; metallized surface; piezoelectric material; surface acoustic wave double delay lines; Acoustic measurements; Acoustic waves; Delay lines; Energy exchange; Fabrication; Metallization; Piezoelectric materials; Sampling methods; Surface acoustic wave devices; Surface acoustic waves; Piezoelectric material; delay lines; electromechanical coupling coefficient; surface acoustic wave;
Conference_Titel :
Piezoelectricity, Acoustic Waves, and Device Applications, 2008. SPAWDA 2008. Symposium on
Conference_Location :
Nanjing
Print_ISBN :
978-1-4244-2891-5
DOI :
10.1109/SPAWDA.2008.4775847