DocumentCode :
2635182
Title :
On the temperature dependence of critical moisture concentration on delamination initiation in microelectronic devices
Author :
Alpern, P. ; Lee, K.C. ; Lee, D. ; Gowda, M. P Javare
Author_Institution :
Infineon Technol. AG, Neubiberg, Germany
fYear :
2012
fDate :
15-19 April 2012
Abstract :
At a given soldering temperature, Ts the delamination initiation between die surface and molding compound of a P-MQFP80 plastic package is determined only by the critical moisture concentration, Ccrit at this interface. In this work, the temperature dependence of critical moisture concentration Ccrit on delaminaton initiation was investigated. Ccrit was found to decrease with increasing soldering temperature.
Keywords :
delamination; integrated circuit packaging; moulding; soldering; P-MQFP80 plastic package; critical moisture concentration; delamination initiation; die surface; microelectronic devices; molding compound; soldering temperature; temperature dependence; Delamination; Moisture; Plastics; Soldering; Stress; Temperature dependence; Temperature distribution; Plastic package; critical moisture concentration; delamination; moisture sensitivity; molding compound;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4577-1678-2
Electronic_ISBN :
1541-7026
Type :
conf
DOI :
10.1109/IRPS.2012.6241885
Filename :
6241885
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2635182
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