• DocumentCode
    2635182
  • Title

    On the temperature dependence of critical moisture concentration on delamination initiation in microelectronic devices

  • Author

    Alpern, P. ; Lee, K.C. ; Lee, D. ; Gowda, M. P Javare

  • Author_Institution
    Infineon Technol. AG, Neubiberg, Germany
  • fYear
    2012
  • fDate
    15-19 April 2012
  • Abstract
    At a given soldering temperature, Ts the delamination initiation between die surface and molding compound of a P-MQFP80 plastic package is determined only by the critical moisture concentration, Ccrit at this interface. In this work, the temperature dependence of critical moisture concentration Ccrit on delaminaton initiation was investigated. Ccrit was found to decrease with increasing soldering temperature.
  • Keywords
    delamination; integrated circuit packaging; moulding; soldering; P-MQFP80 plastic package; critical moisture concentration; delamination initiation; die surface; microelectronic devices; molding compound; soldering temperature; temperature dependence; Delamination; Moisture; Plastics; Soldering; Stress; Temperature dependence; Temperature distribution; Plastic package; critical moisture concentration; delamination; moisture sensitivity; molding compound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2012 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4577-1678-2
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2012.6241885
  • Filename
    6241885
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2635182