DocumentCode :
2635255
Title :
Session Abstract
fYear :
2007
fDate :
39203
Firstpage :
431
Lastpage :
432
Abstract :
Design complexity has grown as technology scaling has continued to make inroads, and it is common to see designs with multiple cores, multiple clock domains, multi-million gates, and tens of thousands of flip-flops. Design cycle time and cost always take precedence over other considerations, making test often a challenge. With design and test teams working on "pushing the envelope" designs, we believe that collaborative innovation between front-end, back-end, DFT, EDA, and tester teams is a key to first-pass success in meeting test cost and time-to-market constraints. The presentations in this session highlight this theme, and showcase another growing trend -- the bourgeoning semiconductor industry in India, which is beginning to develop several innovative and cost effective VLSI test solutions.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Test Symposium, 2007. 25th IEEE
Conference_Location :
Berkeley, CA, USA
ISSN :
1093-0167
Print_ISBN :
0-7695-2812-0
Type :
conf
DOI :
10.1109/VTS.2007.61
Filename :
4209949
Link To Document :
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