• DocumentCode
    2635428
  • Title

    Approximate-Timed Transactional Level Modeling for MPSoC Exploration: A Network-on-Chip Case Study

  • Author

    Guerre, Alexandre ; Ventroux, Nicolas ; David, Raphaël ; Merigot, Alain

  • Author_Institution
    CEA, Embedded Comput. Lab., Gif-sur-Yvette, France
  • fYear
    2009
  • fDate
    27-29 Aug. 2009
  • Firstpage
    390
  • Lastpage
    397
  • Abstract
    The need for computing power drastically increases and one solution is to use MPSoC. These MPSoCs become complex with the increase of the number of cores. Thus, designers use simulators to explore the whole platform parameters in order to define the best architecture. These simulators must be fast and accurate whatever is the architecture complexity. This paper introduces a new approximate-timed TLM approach to provide a speed up of at least x100 on the simulation time in comparison with a timed TLM approach. This new communication method allows fast and accurate hardware parameter exploration of MPSoC with a standard SystemC protocol. The lack of accuracy in networks-on-chip can affect the execution order, but the opposite slows down simulation and cannot support MPSoC exploration. For this reason, this paper focuses on networks-on-chip to demonstrate the benefits of our approximate-timed TLM approach.
  • Keywords
    integrated circuit design; integrated circuit modelling; multiprocessing systems; network-on-chip; system-on-chip; MPSoC exploration; SystemC protocol; approximate-timed transactional level modeling; communication modeling; hardware parameter exploration; network-on-chip; Application software; Circuit simulation; Communication standards; Computational modeling; Computer architecture; Embedded computing; Hardware; Network-on-a-chip; Power system modeling; Protocols;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital System Design, Architectures, Methods and Tools, 2009. DSD '09. 12th Euromicro Conference on
  • Conference_Location
    Patras
  • Print_ISBN
    978-0-7695-3782-5
  • Type

    conf

  • DOI
    10.1109/DSD.2009.169
  • Filename
    5350070