DocumentCode
2635569
Title
Soft Defect Localization (SDL) applied on analog and mixed-mode ICs failure analysis
Author
Li, Jinglong ; Wu, Chunlei
Author_Institution
Product Anal. Lab., Freescale Semicond. (China) Ltd., Tianjin, China
fYear
2012
fDate
15-19 April 2012
Abstract
Soft Defect Localization (SDL) has been applied on digital ICs failure analysis. But for analog and mixed-mode ICs, it is not so common. The analog failure types and characters are various, such as pulse width, amplitude, delay time, and so on. It is difficult to detect them directly by SDL system. In this paper, two FA cases are introduced to explain how to perform SDL on analog failures.
Keywords
failure analysis; mixed analogue-digital integrated circuits; SDL; analog IC; digital IC; failure analysis; mixed-mode IC; soft defect localization; Failure analysis; Heating; Integrated optics; Lasers; Metals; Oscilloscopes; Temperature sensors; Failure Analysis; Soft Defect Localization; self-heating “pass/fail” flag;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2012 IEEE International
Conference_Location
Anaheim, CA
ISSN
1541-7026
Print_ISBN
978-1-4577-1678-2
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2012.6241907
Filename
6241907
Link To Document