• DocumentCode
    2635569
  • Title

    Soft Defect Localization (SDL) applied on analog and mixed-mode ICs failure analysis

  • Author

    Li, Jinglong ; Wu, Chunlei

  • Author_Institution
    Product Anal. Lab., Freescale Semicond. (China) Ltd., Tianjin, China
  • fYear
    2012
  • fDate
    15-19 April 2012
  • Abstract
    Soft Defect Localization (SDL) has been applied on digital ICs failure analysis. But for analog and mixed-mode ICs, it is not so common. The analog failure types and characters are various, such as pulse width, amplitude, delay time, and so on. It is difficult to detect them directly by SDL system. In this paper, two FA cases are introduced to explain how to perform SDL on analog failures.
  • Keywords
    failure analysis; mixed analogue-digital integrated circuits; SDL; analog IC; digital IC; failure analysis; mixed-mode IC; soft defect localization; Failure analysis; Heating; Integrated optics; Lasers; Metals; Oscilloscopes; Temperature sensors; Failure Analysis; Soft Defect Localization; self-heating “pass/fail” flag;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2012 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4577-1678-2
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2012.6241907
  • Filename
    6241907