Title :
PLC-based WDM transceiver with modular structure using chip-scale-packaged OE-devices
Author :
Nakanishi, Y. ; Hirota, H. ; Watanabe, K. ; Hashizume, Y. ; Ogawa, I. ; Ishii, M. ; Kohtoku, M. ; Yanagisawa, M. ; Endo, J. ; Kurosaki, T. ; Inoue, Y.
Author_Institution :
NTT Photonics Laboratories, NTT Corp., Kanagawa
Abstract :
We propose a novel modular integrated structure to improve the fabrication yield and reliability of planar lightwave circuit (PLC) hybrid-integrated modules. As a key component, we have developed a chip-scale packaging technique for opto-electronic (OE-) devices, and successfully fabricated a 1.3/1.49/1.55-mum optical WDM transceiver module
Keywords :
chip-on-board packaging; integrated optics; integrated optoelectronics; modules; optical communication equipment; optical fabrication; optoelectronic devices; reliability; transceivers; wavelength division multiplexing; OE-devices; PLC; WDM; chip-scale-packaging; module; reliability; transceiver; Bonding; Chip scale packaging; Circuits; Diode lasers; Optical design; Optical device fabrication; Optical fibers; Programmable control; Transceivers; Wavelength division multiplexing;
Conference_Titel :
Lasers and Electro-Optics Society, 2005. LEOS 2005. The 18th Annual Meeting of the IEEE
Conference_Location :
Sydney, NSW
Print_ISBN :
0-7803-9217-5
DOI :
10.1109/LEOS.2005.1548171
