DocumentCode
2635607
Title
PLC-based WDM transceiver with modular structure using chip-scale-packaged OE-devices
Author
Nakanishi, Y. ; Hirota, H. ; Watanabe, K. ; Hashizume, Y. ; Ogawa, I. ; Ishii, M. ; Kohtoku, M. ; Yanagisawa, M. ; Endo, J. ; Kurosaki, T. ; Inoue, Y.
Author_Institution
NTT Photonics Laboratories, NTT Corp., Kanagawa
fYear
2005
fDate
22-22 Oct. 2005
Firstpage
662
Lastpage
663
Abstract
We propose a novel modular integrated structure to improve the fabrication yield and reliability of planar lightwave circuit (PLC) hybrid-integrated modules. As a key component, we have developed a chip-scale packaging technique for opto-electronic (OE-) devices, and successfully fabricated a 1.3/1.49/1.55-mum optical WDM transceiver module
Keywords
chip-on-board packaging; integrated optics; integrated optoelectronics; modules; optical communication equipment; optical fabrication; optoelectronic devices; reliability; transceivers; wavelength division multiplexing; OE-devices; PLC; WDM; chip-scale-packaging; module; reliability; transceiver; Bonding; Chip scale packaging; Circuits; Diode lasers; Optical design; Optical device fabrication; Optical fibers; Programmable control; Transceivers; Wavelength division multiplexing;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2005. LEOS 2005. The 18th Annual Meeting of the IEEE
Conference_Location
Sydney, NSW
Print_ISBN
0-7803-9217-5
Type
conf
DOI
10.1109/LEOS.2005.1548171
Filename
1548171
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