DocumentCode :
2635906
Title :
Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation
Author :
Sun, Shishuang ; Pommerenke, David ; Drewniak, James ; Xiao, Kai ; Chen, Sin-Ting ; Wu, Tzong-Lin
Author_Institution :
University of Missouri-Rolla
Volume :
2
fYear :
2006
fDate :
14-18 Aug. 2006
Firstpage :
550
Lastpage :
555
Keywords :
Dielectric losses; Electromagnetic modeling; Equivalent circuits; Finite difference methods; Integral equations; Packaging; SPICE; Sparse matrices; Time domain analysis; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location :
Portland, OR, USA
Print_ISBN :
1-4244-0293-X
Type :
conf
DOI :
10.1109/ISEMC.2006.1706366
Filename :
1706366
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2635906
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