• DocumentCode
    2635925
  • Title

    Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration

  • Author

    Efimovskaya, Alexandra ; Senkal, Doruk ; Askari, Sina ; Shkel, Andrei M.

  • Author_Institution
    Microsyst. Lab., Univ. of California, Irvine, Irvine, CA, USA
  • fYear
    2015
  • fDate
    23-26 March 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper reports a prototype of miniature, <;50 mm3, Timing and Inertial Measurement Unit (TIMU), implemented utilizing a Folded MEMS concept. The approach is based on a wafer-level fabrication of high aspect ratio single-axis sensors, interconnected by flexible polyimide hinges, and then folded into a 3-D configuration, typically in a shape of cube or prism. Co-fabricated thru-wafer interconnects enable interfacing sensors on the device side of the TIMU with signal conditioning electronics potentially integrated inside a folded 3-D structure. We report a TIMU prototype with all 7 sensors operational, thus demonstrating a feasibility of the proposed fabrication approach. In this paper, we emphasize the characterization of the low-noise accelerometers, implemented on the TIMU sidewalls, demonstrating VRW of 0.057 m=s2= p h and bias instability of <;0.2 mg.
  • Keywords
    accelerometers; flexible electronics; integrated circuit interconnections; microsensors; prototypes; signal conditioning circuits; wafer level packaging; TIMU prototype; flexible polyimide hinges; high aspect ratio single-axis sensors; low-noise accelerometers; origami-like folded MEMS; signal conditioning electronics; thru-wafer interconnects; timing and inertial measurement unit; wafer-level fabrication; Accelerometers; Fabrication; Gyroscopes; Integrated circuit interconnections; Micromechanical devices; Prototypes; Sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Inertial Sensors and Systems (ISISS), 2015 IEEE International Symposium on
  • Conference_Location
    Hapuna Beach, HI
  • Type

    conf

  • DOI
    10.1109/ISISS.2015.7102373
  • Filename
    7102373