Title :
Challenges in optoelectronic component packaging for next generation pluggable modules
Author :
Bond, Aaron ; Wolf, Robert ; Stackhouse, Duane ; Sipics, Michael ; Zhang, Jiaming ; Jambunathan, Ram
Author_Institution :
Apogee Photonics, Inc., Allentown, PA
Abstract :
A review of trends in optoelectronic packaging at the component and module level is presented. The trends towards smaller form factor, and lower power dissipation is discussed and the results of a cooled micro TOSA is described. The importance of micro cooler technology and micro optics to the overall technical solution is discussed, along with the application of this technology to higher functionality transmitters
Keywords :
electronics packaging; micro-optics; modules; optical transmitters; optoelectronic devices; cooled micro TOSA; form factor; microoptics; optoelectronic component packaging; pluggable modules; power dissipation; transmitters; Costs; Manufacturing; Optical transmitters; Packaging; Power dissipation; Power lasers; Strain measurement; Temperature; Transceivers; Wavelength division multiplexing;
Conference_Titel :
Lasers and Electro-Optics Society, 2005. LEOS 2005. The 18th Annual Meeting of the IEEE
Conference_Location :
Sydney, NSW
Print_ISBN :
0-7803-9217-5
DOI :
10.1109/LEOS.2005.1548202
