Title :
Signal integrity constrained optimization of flexible printed interconnects for mobile devices
Author :
Grivet-Talocia, S. ; Acquadro, S. ; Bandinu, M. ; Canavero, F.G. ; Kelander, I. ; Rouvala, M.
Author_Institution :
Politecnico di Torino
Keywords :
Attenuation; Computational modeling; Constraint optimization; Flexible printed circuits; Frequency; Geometry; Impedance; Integrated circuit interconnections; Signal analysis; Solid modeling;
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location :
Portland, OR, USA
Print_ISBN :
1-4244-0293-X
DOI :
10.1109/ISEMC.2006.1706388