DocumentCode :
2636336
Title :
Modeling of multilayered packages and boards using modal decomposition and finite difference methods
Author :
Engin, A. Ege ; Bharath, Krishna ; Srinivasan, Krishna ; Swaminathan, Madhavan
Author_Institution :
Georgia Institute of Technology
Volume :
3
fYear :
2006
fDate :
14-18 Aug. 2006
Firstpage :
646
Lastpage :
650
Keywords :
Apertures; Couplings; Distributed parameter circuits; Electromagnetic interference; Finite difference methods; Packaging; Power system modeling; Power transmission lines; Stripline; Transmission line discontinuities;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location :
Portland, OR, USA
Print_ISBN :
1-4244-0293-X
Type :
conf
DOI :
10.1109/ISEMC.2006.1706390
Filename :
1706390
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2636336
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