• DocumentCode
    2636336
  • Title

    Modeling of multilayered packages and boards using modal decomposition and finite difference methods

  • Author

    Engin, A. Ege ; Bharath, Krishna ; Srinivasan, Krishna ; Swaminathan, Madhavan

  • Author_Institution
    Georgia Institute of Technology
  • Volume
    3
  • fYear
    2006
  • fDate
    14-18 Aug. 2006
  • Firstpage
    646
  • Lastpage
    650
  • Keywords
    Apertures; Couplings; Distributed parameter circuits; Electromagnetic interference; Finite difference methods; Packaging; Power system modeling; Power transmission lines; Stripline; Transmission line discontinuities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
  • Conference_Location
    Portland, OR, USA
  • Print_ISBN
    1-4244-0293-X
  • Type

    conf

  • DOI
    10.1109/ISEMC.2006.1706390
  • Filename
    1706390
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2636336