Abstract :
The following topics are dealt with: thermal management; heat transfer; microelectronics cooling; electronic packaging; thermocouples; pipe flow; heat exchangers; heat pipes; printed circuit boards; heat conduction; convection
Keywords :
convection; cooling; electronics packaging; heat conduction; heat exchangers; heat pipes; heat transfer; pipe flow; power electronics; printed circuits; thermal management (packaging); thermocouples; convection; cooling; electronic packaging; heat conduction; heat exchangers; heat pipes; heat transfer; pipe flow; power microelectronics; printed circuit boards; thermal management; thermocouples;
Conference_Titel :
Thermal Issues in Emerging Technologies: Theory and Application, 2007. THETA 2007. International Conference on
Conference_Location :
Cairo
Print_ISBN :
1-4244-0896-2
DOI :
10.1109/THETA.2007.363392
