Title :
Crosstalk and delay time analysis of high density interconnects on LTCC substrate
Author :
Orlandi, A. ; Antonini, G. ; Moca, C. ; Scogna, A. Ciccomancini
Author_Institution :
University of L´´Aquila
Keywords :
Application specific integrated circuits; Ceramics; Crosstalk; Delay effects; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Multiplexing; Performance analysis; Temperature;
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location :
Portland, OR, USA
Print_ISBN :
1-4244-0293-X
DOI :
10.1109/ISEMC.2006.1706397
