• DocumentCode
    2636458
  • Title

    Power and Thermal Management in VLSI Circuits

  • Author

    Mohab, Anis

  • Author_Institution
    Waterloo Univ., Ont.
  • fYear
    2007
  • fDate
    3-6 Jan. 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The use of integrated circuits in high-performance computing, telecommunications, and consumer electronics has been growing at a booming pace. As more and more complex functions are required in various data processing devices, the need to integrate these functions in a small package is also increasing. The integration of a large number of functions on a single chip as well as the scaling of technology brings up enormous challenges that must be resolved by designers. As the silicon industry moves towards nanometer designs, one of the most important design challenges cited is the growing chip power consumption and its impact on the chip´s thermal integrity. This phenomenon threats the life time of silicon technology and will hinder the proliferation of the microelectronics industry if not controlled
  • Keywords
    VLSI; semiconductor technology; silicon; VLSI circuits; chip power consumption; data processing devices; microelectronics industry; nanometer designs; power management; silicon industry; silicon technology; single chip; thermal integrity; thermal management; Circuits; Consumer electronics; Data processing; Electronic packaging thermal management; Energy management; Silicon; Telecommunication computing; Thermal management; Thermal management of electronics; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Issues in Emerging Technologies: Theory and Application, 2007. THETA 2007. International Conference on
  • Conference_Location
    Cairo
  • Print_ISBN
    1-4244-0897-0
  • Electronic_ISBN
    1-4244-0897-0
  • Type

    conf

  • DOI
    10.1109/THETA.2007.363398
  • Filename
    4211076