DocumentCode
2636470
Title
Modeling and simulation of IC and package power/ground network
Author
Park, Hyunjeong ; Gam, Dong Gun ; Kim, Joungho ; Kim, Hyungsoo
Author_Institution
Korea Advanced Institute of Science and Technology
Volume
3
fYear
2006
fDate
14-18 Aug. 2006
Firstpage
696
Lastpage
701
Keywords
Equivalent circuits; Frequency; Integrated circuit modeling; Integrated circuit noise; Integrated circuit packaging; MOS capacitors; Noise generators; Power generation; Semiconductor device noise; Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location
Portland, OR, USA
Print_ISBN
1-4244-0293-X
Type
conf
DOI
10.1109/ISEMC.2006.1706399
Filename
1706399
Link To Document