DocumentCode :
2636536
Title :
EMI model improvement taking LSI package structure into consideration
Author :
Ichikawa, Kazuhisa ; Unou, T. ; Tsuda, Toshitaka ; Mabuchi, Yusaku ; Nagata, M. ; Ichikawa, Kazuhisa
Author_Institution :
DENSO CORPORATION
Volume :
3
fYear :
2006
fDate :
14-18 Aug. 2006
Firstpage :
707
Lastpage :
711
Keywords :
Circuit noise; Circuit simulation; Electromagnetic compatibility; Electromagnetic interference; Large scale integration; Packaging; Pins; Power supplies; Power system modeling; Semiconductor device noise;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location :
Portland, OR, USA
Print_ISBN :
1-4244-0293-X
Type :
conf
DOI :
10.1109/ISEMC.2006.1706401
Filename :
1706401
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2636536
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