Title :
EMI model improvement taking LSI package structure into consideration
Author :
Ichikawa, Kazuhisa ; Unou, T. ; Tsuda, Toshitaka ; Mabuchi, Yusaku ; Nagata, M. ; Ichikawa, Kazuhisa
Author_Institution :
DENSO CORPORATION
Keywords :
Circuit noise; Circuit simulation; Electromagnetic compatibility; Electromagnetic interference; Large scale integration; Packaging; Pins; Power supplies; Power system modeling; Semiconductor device noise;
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location :
Portland, OR, USA
Print_ISBN :
1-4244-0293-X
DOI :
10.1109/ISEMC.2006.1706401