DocumentCode :
2636594
Title :
Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
Author :
Nakayama, Wataru
Author_Institution :
ThermTech Int., Kanagawa
fYear :
2007
fDate :
3-6 Jan. 2007
Firstpage :
41
Lastpage :
48
Abstract :
An analytical model is developed to study the heat transfer performance of PCBs. The PCB under study is the substrate for a ball-grid-array (BGA) package, having a belt of densely populated through-thickness vias and continuous copper layers that extend to a larger area beyond the via zone. The analytical formulas are derived to estimate the effects of the geometric and thermal parameters without resorting to resource-demanding numerical analysis. Calculations are performed on the example board that has a footprint area 11 times11 cm 2, a thickness 1.26 mm, 2 continuous copper layers, and a 4.4times4.4 cm2 BGA package. The impacts of some parameters such as the width of the insulation gap around the via, the area of copper coverage at the via bottom, and the population of vias on the temperature and the heat flow are presented in graphs
Keywords :
ball grid arrays; heat conduction; printed circuits; 1.26 mm; ball-grid-array package; heat conduction; heat flow; insulation gap; mesoscale modeling; printed circuit boards; Computational fluid dynamics; Copper; Electronic packaging thermal management; Heat transfer; Integrated circuit interconnections; Laminates; Numerical analysis; Packaging machines; Printed circuits; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Issues in Emerging Technologies: Theory and Application, 2007. THETA 2007. International Conference on
Conference_Location :
Cairo
Print_ISBN :
1-4244-0896-2
Electronic_ISBN :
1-4244-0897-0
Type :
conf
DOI :
10.1109/THETA.2007.363407
Filename :
4211085
Link To Document :
بازگشت