DocumentCode

2636761

Title

Power integrity considerations for CPU EMI-reducing interconnect design

Author

Hockanson, David M.

Author_Institution

Sun Microsystems, Inc.

Volume

3

fYear

2006

fDate

14-18 Aug. 2006

Firstpage

770

Lastpage

775

Keywords

Design engineering; Electromagnetic compatibility; Frequency; Inductance; Integrated circuit interconnections; Packaging; Pins; Power harmonic filters; Sun; USA Councils;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on

Conference_Location

Portland, OR, USA

Print_ISBN

1-4244-0293-X

Type

conf

DOI

10.1109/ISEMC.2006.1706414

Filename

1706414