DocumentCode :
2636797
Title :
Quantitative investigation of impurity distribution in ZMR SOI layers
Author :
Mertens, P.W. ; Maes, H.E.
Author_Institution :
Interuniv. Micro Electron. Center, Leuven, Belgium
fYear :
1989
fDate :
3-5 Oct 1989
Firstpage :
76
Lastpage :
77
Abstract :
Summary form only given. The redistribution of oxygen and nitrogen in zone-melting recrystallized (ZMR) layers is discussed. During the ZMR process the silicon layer is exposed on both sides to SiO2 layers at very high temperatures. As a result a high oxygen content may be expected. In-depth SIMS analysis with enhanced sensitivity for oxygen was used to analyze SOI layers with thicknesses ranging from 0.5 to 25 μm. Typically a symmetric bump-shaped oxygen profile was obtained. A strong redistribution of oxygen takes place after solidification. SIMS profiles were also obtained of the nitrogen distribution. In samples with a compound capping layer consisting of a thin nitride or oxynitride on top of a thick CVD oxide, significant nitrogen peaks were found at the Si-SiO2 interfaces immediately after deposition. The peaks increased as the samples were heated and became even more pronounced after ZMR. Different structures in which the nitrogen source was a CVD layer, a NH3, a NH3 anneal, or a nitrogen implant were investigated
Keywords :
elemental semiconductors; impurity distribution; incoherent light annealing; ion implantation; mass spectroscopic chemical analysis; secondary ion mass spectra; semiconductor doping; semiconductor-insulator boundaries; silicon; zone melting; 0.5 to 25 micron; CVD layer; NH3 anneal; SOI layers; Si-SiO2; Si:N; Si:O; compound capping layer; elemental semiconductor; impurity distribution; quantitative investigation; secondary ion mass spectra; thickness range; zone melting recrystallised layers; Atomic layer deposition; Cooling; Impurities; Kinetic theory; Lamps; Nitrogen; Oxygen; Silicon; Temperature sensors; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOS/SOI Technology Conference, 1989., 1989 IEEE
Conference_Location :
Stateline, NV
Type :
conf
DOI :
10.1109/SOI.1989.69773
Filename :
69773
Link To Document :
بازگشت