Integrated Electronics at UHF

The development of microwave microcircuit utilizing uncased semiconductor chips and thin films promises a revolution in the design and construction of microwave circuits. The more intimate contact between the semiconductor device and circuit, without constraints of the package, will allow the attainment of device performance never before achieved. The construction of rf circuitry in a standardized micromodule form will allow rf circuitry to be compatible with standard microelectronic packaging techniques and similar in cost to low frequency circuits.