Abstract :
The following topics are dealt with: PCB based technology; hardware acceleration; solder materials; microelectronics; server based mailing; adhesives; thin film transistors; advanced packaging; power electronics; assembly; electrical design; optoelectronics and applied reliability.
Keywords :
electronics packaging; optoelectronic devices; printed circuits; reliability; solders; PCB based technology; adhesives; advanced packaging; applied reliability; assembly; electrical design; hardware acceleration; microelectronics; optoelectronics; power electronics; server based mailing; solder materials; thin film transistors;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
Conference_Location :
Timisoara
Print_ISBN :
978-1-4577-1276-0
Electronic_ISBN :
978-1-4577-1275-3
DOI :
10.1109/SIITME.2011.6102637
