Title :
An electrical design methodology for multi-chip modules
Author_Institution :
IBM East Fishkill Semiconductor Laboratory, Hopewell Junction, NY 12533
Keywords :
Circuits; Design methodology; Laboratories; Power distribution; Semiconductor device noise; Semiconductor device packaging; Signal design;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1992
Print_ISBN :
0-7803-0683-X
DOI :
10.1109/EPEP.1992.572248
