DocumentCode

2638062

Title

An electrical design methodology for multi-chip modules

Author

Davidson, Evan

Author_Institution

IBM East Fishkill Semiconductor Laboratory, Hopewell Junction, NY 12533

fYear

1992

fDate

22-24 Apr 1992

Firstpage

3

Lastpage

3

Keywords

Circuits; Design methodology; Laboratories; Power distribution; Semiconductor device noise; Semiconductor device packaging; Signal design;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1992

Print_ISBN

0-7803-0683-X

Type

conf

DOI

10.1109/EPEP.1992.572248

Filename

572248