Title :
Design of self-adaptive fuzzy-pid controller based on DSP and FPGA for rapid thermal processing
Author :
Liu, Jingmeng ; Li, Shangfeng ; Wu, Xingming ; Chen, Baicheng
Author_Institution :
Sch. of Autom. Sci. & Electr. Eng., Beihang Univ., Beijing, China
Abstract :
The features of RTP (rapid thermal processing) temperature control system are analyzed. Regarding TI´s DSP chip TMS320LF2407A as the main chip, adopted FPGA for logical and sequential control, temperature controller based on DSP and FPGA has been designed. DSP is used as executing temperature control algorithms and FPGA as logic unit for temperature sampling and display. The hardware configuration and principle is introduced firstly, and then the temperature control algorithm based on self-adaptive fuzzy-PID is designed. Finally, the simulation and experiment results show that the self-adaptive fuzzy-PID controller based on DSP and FPGA has good robustness, rapidity and good dynamic performance. Besides, the structure of hardware design based on DSP and FPGA has four prominent features such as modularization, flexibility, timing and extensibility.
Keywords :
adaptive control; control system synthesis; digital signal processing chips; field programmable gate arrays; fuzzy control; microcontrollers; programmable controllers; rapid thermal processing; robust control; self-adjusting systems; semiconductor technology; temperature control; three-term control; DSP chip TMS320LF2407A; FPGA; RTP; dynamic performance; hardware configuration; hardware design; logic unit; logical control; rapid thermal processing; robustness; self-adaptive fuzzy-PID controller; sequential control; temperature control algorithms; temperature control system; temperature controller; temperature sampling; Algorithm design and analysis; Digital signal processing; Field programmable gate arrays; Hardware; Process control; Rapid thermal processing; Temperature control; DSP and FPGA; rapid thermal processing; self-adaptive fuzzy-PID; temperature control;
Conference_Titel :
Industrial Electronics and Applications (ICIEA), 2011 6th IEEE Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-8754-7
Electronic_ISBN :
pending
DOI :
10.1109/ICIEA.2011.5975855