Title :
Characterization of mechanical and physical parameters of IMCs in solder materials using nano hardness tests and EBSD measurements
Author :
Klima, S. ; Villain, J. ; Corradi, U. ; Weippert, Chr ; Svetly, A.
Author_Institution :
Univ. of Appl. Sci. Augsburg, Augsburg, Germany
Abstract :
In lead free solder alloys - SnAgCu or SnZn alloys - the knowledge of the composition and the mechanical behavior of their IMCs is important to understand the reliability of small solder joint built up by one or two grains. Metallographic investigations, hardness testing and EBSD measurements (Electron Backscatter Diffraction) will be combined to characterize the mechanical and physical parameters of phases - 0-tin or IMCs. A combination of theses measurements is necessary due to the anisotropic behavior of tin and its IMCs. First results will be presented.
Keywords :
copper alloys; electron backscattering; hardness testing; nanotechnology; reliability; silver alloys; solders; tin alloys; zinc alloys; EBSD measurements; IMC; SnAgCu; SnZn; anisotropic behavior; electron backscatter diffraction; lead free solder alloys; mechanical behavior; nanohardness tests; small solder joint reliability; solder materials; Aging; Copper; Soldering; Substrates; Temperature measurement; Zinc; IMC; SnZn alloy; SnZnAl-alloy; activation energy; hardness;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
Conference_Location :
Timisoara
Print_ISBN :
978-1-4577-1276-0
Electronic_ISBN :
978-1-4577-1275-3
DOI :
10.1109/SIITME.2011.6102680
