2638852

Design of controlled slew rate CMOS output driver and optimum package-pin placement to minimize the "effective" power/ground switching noise

Senthinathan, R. ; Prince, J.L.

Center for Electrical Packaging Research, department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ 85721

1992

22-24 Apr 1992

15

18

Bonding; Circuit noise; Driver circuits; Electronics packaging; Frequency; Noise reduction; Space vector pulse width modulation; Switches; Variable structure systems; Voltage;

English

ieee

Electrical Performance of Electronic Packaging, 1992

0-7803-0683-X

conf

10.1109/EPEP.1992.572252

572252