DocumentCode :
2639174
Title :
New High Frequency Model For Substrate Crosstalk Noise Injected By SOI Devices
Author :
Karami, M.A. ; Masoumi, N. ; Forouzandeh, B.
Author_Institution :
Tehran Univ.
fYear :
2006
fDate :
22-24 June 2006
Firstpage :
495
Lastpage :
499
Abstract :
Silicon on insulator (SOI) device and circuits are used for decreasing the amount of noise, which transmits from one device to others on the same chip. While an SOI based process provides high isolation from crosstalk at low operating frequencies, its benefits are lost at high frequencies. In this paper the mechanisms, which cause production of substrate noise in CMOS devices, are discussed and compared between bulk and SOI devices. It was shown that, increasing the amount of impact ionization current is the main reason for substrate noise degradation in high frequency SOI circuits compared with bulk devices. In this paper, a new model is introduced for analyzing substrate noise in high frequency SOI devices, by considering impact ionization currents
Keywords :
CMOS integrated circuits; impact ionisation; integrated circuit modelling; integrated circuit noise; silicon-on-insulator; substrates; CMOS devices; high frequency SOI circuits; high frequency SOI devices; high frequency model; impact ionization current; silicon on insulator device; substrate crosstalk noise; substrate noise degradation; Circuit noise; Coupling circuits; Crosstalk; Degradation; Frequency; Impact ionization; Noise reduction; Silicon on insulator technology; Substrate hot electron injection; Thin film transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006. Proceedings of the International Conference
Conference_Location :
Gdynia
Print_ISBN :
83-922632-2-7
Type :
conf
DOI :
10.1109/MIXDES.2006.1706629
Filename :
1706629
Link To Document :
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