Title :
Optimization of breaking processes in LTCC manufacturing
Author :
Horváth, Eszter ; Erényi, András ; Géczy, Attila ; Harsányi, Gábor
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
Abstract :
The effect of mechanical relief and dividing parameters of LTCC are investigated. Two mechanical relief techniques - diamond wheel scratching and laser scribing - are discussed in the paper. The parameters of breaking were also examined. Based on these results, the parameters could be optimized, improving the technology of low temperature co-fired ceramic (LTCC) circuit production. With these settings, less production losses could be expected in the field of LTCC technology.
Keywords :
automotive electronics; ceramic packaging; ceramics; firing (materials); LTCC circuit production; LTCC manufacturing; breaking process optimization; diamond wheel scratching; laser scribing; low temperature cofired ceramics; Ceramics; Force; Lasers; Stress; Substrates; Wheels; LTCC; diamond wheel scratching; laser scribing; mechanical relief;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
Conference_Location :
Timisoara
Print_ISBN :
978-1-4577-1276-0
Electronic_ISBN :
978-1-4577-1275-3
DOI :
10.1109/SIITME.2011.6102708
