DocumentCode :
2639350
Title :
Development of SAW filters based on GaPO4
Author :
Schiopu, P. ; Cristea, I. ; Grosu, N. ; Craciun, A.
Author_Institution :
Optoelectron. Res. Center, Politeh. Univ. of Bucharest, Bucharest, Romania
fYear :
2011
fDate :
20-23 Oct. 2011
Firstpage :
169
Lastpage :
172
Abstract :
The results of research into Surface Acoustic Wave - SAW - devices have been recognized for their efficiency and versatility in the electrical signals processing [1], [3]. Actual progress in the industrial application of piezoelectric materials such as Lithium Niobate (LiNbO3), Langasite (LGS), Lanthanum-Gallium Silicate La3Ga5SiO14 and Gallium Orthophosphate (GaPO4), allows the manufacturing of devices with performances, which overcome the limits obtained with quartz crystals [2]. The single crystal materials have a long term high stability - near to infinite - and moreover, some of these have an excellent behavior with temperature variation, as is the case of GaPO4 [4]. Today, GaPO4 with its properties is by far the best suited piezoelectric material to be used in sensor applications for machine monitoring and pressure measurements, at high temperatures. SAW microdevices based on GaPO4 operate at temperatures of up to 800°C. We have developed five SAW filters based on GaPO4. The paper describes the steps to solve the problems regarding the use of GaPO4 substrates for the development of SAW filters. In the 3rd chapter of the paper are given some experimental results obtained with Network Analyzer.
Keywords :
network analysers; piezoelectric materials; quartz; surface acoustic wave filters; GaPO4; La3Ga5SiO14; LiNbO3; SAW filters; electrical signals processing; network analyzer; piezoelectric materials; quartz crystals; surface acoustic wave; Laser beams; SAW filters; Substrates; Surface acoustic wave devices; Surface acoustic waves; Temperature measurement; Temperature sensors; GaPO4; SAW devices; interdigital transducer; piezoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for
Conference_Location :
Timisoara
Print_ISBN :
978-1-4577-1276-0
Electronic_ISBN :
978-1-4577-1275-3
Type :
conf
DOI :
10.1109/SIITME.2011.6102711
Filename :
6102711
Link To Document :
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