DocumentCode :
2639664
Title :
High-aspect-ratio lines as dense off-chip interconnects
Author :
Blennemann, Heinz ; Pease, R. Fabian
Author_Institution :
Department of Electrical Engineering, Stanford University, Stanford, CA 94305
fYear :
1992
fDate :
22-24 Apr 1992
Firstpage :
28
Lastpage :
30
Keywords :
Attenuation; Conductors; Crosstalk; Dielectrics; Distortion measurement; Gold; Impedance; Microstrip; Polymers; Stripline;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1992
Print_ISBN :
0-7803-0683-X
Type :
conf
DOI :
10.1109/EPEP.1992.572256
Filename :
572256
Link To Document :
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