Influence of thermal aging on the reliability of electrically conductive adhesives

Quality of electrically conductive adhesives is a main component in electronic packaging. It highly influences the total quality of a product containing such a component. With time and usage, adhesives lose some of the qualities. In some cases, changes in the molecule structure for example, can be responsible for this influence on material characteristics. This process is known as aging. It can badly affect the total electrical conductivity of adhesives and non-linearity, even mechanical properties of adhesive joints can be affected. In research field, aging is applied to test the expected reactions of the most important material parameters of electrically conductive adhesives. It also helps identifying the total operating life of the tested components. This work focuses primarily on analyzing the effect of thermal aging on the resistance of three types of adhesives, one of these adhesives is a two-component type, and the other two are one-component type.