• DocumentCode
    264021
  • Title

    GENI: Large-scale distributed infrastructure for networking and distributed systems research

  • Author

    Berman, M. ; Elliott, Chip ; Landweber, Lawrence

  • Author_Institution
    GENI Project Office, Raytheon BBN Technol., Cambridge, MA, USA
  • fYear
    2014
  • fDate
    July 30 2014-Aug. 1 2014
  • Firstpage
    156
  • Lastpage
    161
  • Abstract
    GENI, the Global Environment for Networking Innovation, is a distributed virtual laboratory for research in networking and distributed systems, with applications in domain science. The main components of GENI include OpenFlow-enabled software defined networking (SDN) resources deployed on over 40 university campuses across the U.S. These resources include both switches and GENI Racks (SDN capable compute clusters with OpenFlow switches for internal and external communications). GENI Racks are currently installed on dozens of university campuses and within R&E network backbones. Also available is a diverse group of programmable computing and wireless networking resources. Researchers access this collection of resources via the key GENI techniques of deep programmability and slicing. Collectively, these resources and methods enable GENI to support a wide variety of research efforts.
  • Keywords
    distributed processing; program slicing; radio networks; GENI racks; GENI techniques; OpenFlow switches; OpenFlow-enabled software defined networking resources; R&E network backbones; SDN resources; distributed systems research; distributed virtual laboratory; external communication; global environment for networking innovation; internal communication; large-scale distributed infrastructure; networking system; programmability; programmable computing; slicing; university campuses; wireless networking resources; Aggregates; Atmospheric measurements; Cryptography; Extraterrestrial measurements; Nickel; Particle measurements; Virtualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications and Electronics (ICCE), 2014 IEEE Fifth International Conference on
  • Conference_Location
    Danang
  • Print_ISBN
    978-1-4799-5049-2
  • Type

    conf

  • DOI
    10.1109/CCE.2014.6916696
  • Filename
    6916696