Title :
Analysis of failure rate prediction by using part stress method for printed circuit board assemblies in power electronics building block
Author :
Grinberg, R. ; Riedel, G.J. ; Dalessandro, L. ; Steimer, P. ; Apeldoorn, O.
Author_Institution :
Corp. Res., ABB Switzerland Ltd., Baden-Dättwil, Switzerland
Abstract :
In this paper, the reliability prediction of a power electronics building block (PEBB) printed circuit board assembly (PCBA) is performed using the Part Stress Method from the MIL-HDBK-217FN2 handbook. The breakdown of the predicted reliability with respect to circuit functional blocks is presented. Furthermore, different cases are shown, where the components with small or large failure rate dominate. Finally, the ANSI-VITA51.1 adjustments are applied and their influence on the reliability prediction results and their usage are discussed.
Keywords :
failure analysis; integrated circuit reliability; power electronics; printed circuits; ANSI-VITA51.1; MIL-HDBK-217FN2 handbook; PCBA; PEBB reliability prediction; circuit functional blocks; failure rate prediction analysis; part stress method; power electronic building block reliability prediction; printed circuit board assemblies; PCBA; PEBB; Reliability prediction; failure rate;
Conference_Titel :
Power Electronics, Machines and Drives (PEMD 2012), 6th IET International Conference on
Conference_Location :
Bristol
Electronic_ISBN :
978-1-84919-616-1
DOI :
10.1049/cp.2012.0335
