Analysis of failure rate prediction by using part stress method for printed circuit board assemblies in power electronics building block

Author

Grinberg, R. ; Riedel, G.J. ; Dalessandro, L. ; Steimer, P. ; Apeldoorn, O.

Author_Institution

Corp. Res., ABB Switzerland Ltd., Baden-Dättwil, Switzerland

fYear

2012

fDate

27-29 March 2012

Firstpage

1

Lastpage

5

Abstract

In this paper, the reliability prediction of a power electronics building block (PEBB) printed circuit board assembly (PCBA) is performed using the Part Stress Method from the MIL-HDBK-217FN2 handbook. The breakdown of the predicted reliability with respect to circuit functional blocks is presented. Furthermore, different cases are shown, where the components with small or large failure rate dominate. Finally, the ANSI-VITA51.1 adjustments are applied and their influence on the reliability prediction results and their usage are discussed.

Keywords

failure analysis; integrated circuit reliability; power electronics; printed circuits; ANSI-VITA51.1; MIL-HDBK-217FN2 handbook; PCBA; PEBB reliability prediction; circuit functional blocks; failure rate prediction analysis; part stress method; power electronic building block reliability prediction; printed circuit board assemblies; PCBA; PEBB; Reliability prediction; failure rate;

fLanguage

English

Publisher

iet

Conference_Titel

Power Electronics, Machines and Drives (PEMD 2012), 6th IET International Conference on

Conference_Location

Bristol

Electronic_ISBN

978-1-84919-616-1

Type

conf

DOI

10.1049/cp.2012.0335

Filename

6242187