Title :
Manufacturing defects testing of a multi-chip-module using IEEE 1149.1 boundary scan test and embedded built-in test software
Author :
Round, Brenda J.
Author_Institution :
Texas Instruments Inc., Plano, TX, USA
Abstract :
This paper describes the use of boundary scan based tests and embedded built in test (BIT) software in the manufacturing defects testing of a 100 MHz, high density, surface mount multi-chip-module, parallel processing computer
Keywords :
automatic test equipment; boundary scan testing; fault diagnosis; fault location; multichip modules; parallel architectures; production testing; surface mount technology; 100 MHz; ASIC; Aladdin; IEEE 1149.1 boundary scan test; MCM; embedded built-in test software; manufacturing defects testing; parallel processing computer; surface mount multi-chip-module; Application specific integrated circuits; Assembly; Built-in self-test; Circuit testing; Embedded software; Logic testing; Manufacturing; Packaging; Registers; Software testing;
Conference_Titel :
AUTOTESTCON '93. IEEE Systems Readiness Technology Conference. Proceedings
Conference_Location :
San Antonio, TX
Print_ISBN :
0-7803-0646-5
DOI :
10.1109/AUTEST.1993.396355
