Title :
Microprocessors in the Era of Terascale Integration
Author :
Borkar, Shekhar ; Jouppi, Norman P. ; Stenstrom, Per
Author_Institution :
Intel Corp., Hillsboro, OR
Abstract :
Moore´s law has deliver tera-scale level transistor integration capacity. Power, variability, reliability, aging, and testing are pose as barriers and challenges to harness this integration capacity. Advances in microarchitecture and programming systems discussed in this paper are potential solutions
Keywords :
integrated circuit reliability; logic testing; microprocessor chips; Moore´s law; microarchitecture systems; microprocessors; programming systems; terascale level transistor integration capacity; Dielectrics; Error correction codes; Logic; Microarchitecture; Microprocessors; Moore´s Law; Single event upset; Testing; Threshold voltage; Transistors;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition, 2007. DATE '07
Conference_Location :
Nice
Print_ISBN :
978-3-9810801-2-4
DOI :
10.1109/DATE.2007.364597
