Title : 
Three-channel 77 GHz automotive radar transmitter in plastic package
         
        
            Author : 
Knapp, Herbert ; Treml, Markus ; Schinko, Andreas ; Kolmhofer, Erich ; Matzinger, Stefan ; Strasser, Georg ; Lachner, Rudolf ; Maurer, Linus ; Minichshofer, Jurgen
         
        
            Author_Institution : 
Infineon Technol., Neubiberg, Germany
         
        
        
        
        
        
            Abstract : 
We present a three-channel 77GHz radar transmitter in an embedded wafer-level ball grid array (eWLB) package. The circuit is manufactured in a 0.35 μm SiGe bipolar process. It contains a 77GHz push-push oscillator and three independent power amplifiers with digital power control and a maximum output power of 11.7 dBm. Various frequency divider stages and an additional 18GHz oscillator and down-converter allow the realisation of single-loop and offset PLLs. The 77GHz and 18 GHz oscillators achieve a phase noise of -76 dBc/Hz and -93 dBc/Hz, at 100 kHz offset, respectively. The transmitter operates with a supply voltage of 3.3V and consumes between 205mA and 710 mA, depending on the configuration.
         
        
            Keywords : 
ball grid arrays; digital control; frequency dividers; microwave oscillators; millimetre wave oscillators; millimetre wave power amplifiers; millimetre wave radar; phase locked loops; phase noise; plastic packaging; power control; radar transmitters; road vehicle radar; wafer level packaging; bipolar process; current 205 mA; current 710 mA; digital power control; down-converter; eWLB packaging; embedded wafer-level ball grid array packaging; frequency 18 GHz; frequency 77 GHz; frequency divider; offset PLL; phase noise; plastic packaging; power amplifier; push-push oscillator; single-loop PLL; size 0.35 mum; three-channel automotive radar transmitter; voltage 3.3 V; Frequency conversion; Phase noise; Radar; Sensors; Tuning; Voltage-controlled oscillators; Millimeter wave integrated circuits; automotive radar; plastic integrated circuit packaging;
         
        
        
        
            Conference_Titel : 
Radio Frequency Integrated Circuits Symposium (RFIC), 2012 IEEE
         
        
            Conference_Location : 
Montreal, QC
         
        
        
            Print_ISBN : 
978-1-4673-0413-9
         
        
            Electronic_ISBN : 
1529-2517
         
        
        
            DOI : 
10.1109/RFIC.2012.6242245