DocumentCode
2641453
Title
Trends in packaging and high density interconnection
Author
Beyne, E. ; Mertens, R.
Author_Institution
IMEC, Leuven, Belgium
fYear
1999
fDate
22-24 Nov. 1999
Firstpage
11
Lastpage
15
Abstract
In this paper, some of the main trends in packaging and interconnection technology for microelectronic devices are reviewed. Particular attention is given to the impact of the evolution of microelectronic technology on the requirements for electronic packaging.
Keywords
integrated circuit interconnections; integrated circuit packaging; multichip modules; MCM; MCM-D; electronic packaging; high density interconnection; interconnection technology; microelectronic devices; microelectronic technology; packaging; Chemical sensors; Clocks; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Logic devices; Microelectronics; Packaging machines; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 1999. ICM '99. The Eleventh International Conference on
Print_ISBN
0-7803-6643-3
Type
conf
DOI
10.1109/ICM.2000.884794
Filename
884794
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