Title :
Trends in packaging and high density interconnection
Author :
Beyne, E. ; Mertens, R.
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
In this paper, some of the main trends in packaging and interconnection technology for microelectronic devices are reviewed. Particular attention is given to the impact of the evolution of microelectronic technology on the requirements for electronic packaging.
Keywords :
integrated circuit interconnections; integrated circuit packaging; multichip modules; MCM; MCM-D; electronic packaging; high density interconnection; interconnection technology; microelectronic devices; microelectronic technology; packaging; Chemical sensors; Clocks; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Logic devices; Microelectronics; Packaging machines; Transistors;
Conference_Titel :
Microelectronics, 1999. ICM '99. The Eleventh International Conference on
Print_ISBN :
0-7803-6643-3
DOI :
10.1109/ICM.2000.884794
