DocumentCode
2641613
Title
Experimental investigation on the impulse force characteristics in EIDI system
Author
Guangchao, Li ; Jiang, He ; Guiping, Lin
Author_Institution
Sch. of Aeronaut. Sci. & Eng., Beihang Univ., Beijing, China
fYear
2011
fDate
21-23 June 2011
Firstpage
2558
Lastpage
2562
Abstract
Electro-impulse de-icing (EIDI) system has become one of the important part of aviation de-icing technology, because of its advantages in low power consumption, light weight, convenient maintenance, well reliability, little expense and so on. Electrodynamics analysis is the fundamental basis of the EIDI system design, providing impulse force characteristics for the ensuing stage of structural dynamics analysis and icing region prediction. Since electrodynamics analysis deals with the coupling of electric field, magnetic field and structure deformation, it is incontinent to setup mathematical-physical model close to reality. Therefore, the present work developed a prototype of EIDI system, and investigated the impulse force characteristics experimentally. The feasibility and validity of the EIDI prototype has been verified, and the effect of charging voltage, coil-to-skin gap, skin thickness and conductivity onto the maximum impulse force with has been studied. Moreover, a correlation between the maximum impulse force and the induced peak current intensity is proposed.
Keywords
aircraft; electric fields; electrodynamics; magnetic fields; EIDI system; aviation deicing technology; charging voltage; coil-to-skin gap; conductivity; electric field; electro-impulse deicing; electrodynamics analysis; icing region prediction; impulse force characteristic; magnetic field; peak current intensity; skin thickness; structural dynamics analysis; structure deformation; Aircraft; Coils; Correlation; Force; Metals; Prototypes; Skin; electric impulse deicing system; electrodynamics analysis; impulse force; piezoelectric force sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics and Applications (ICIEA), 2011 6th IEEE Conference on
Conference_Location
Beijing
ISSN
pending
Print_ISBN
978-1-4244-8754-7
Electronic_ISBN
pending
Type
conf
DOI
10.1109/ICIEA.2011.5976024
Filename
5976024
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