Title :
Die thickness impact on thermo-mechanical stress in 3D packages
Author :
Salahouelhadj, A. ; Gonzalez, M. ; Oprins, H.
Author_Institution :
Imec, Leuven, Belgium
Abstract :
In this study, Finite Element Modeling (FEM) is used to predict the stress and deformation induced by packaging and temperature hot spots for 3D-IC packages. The studied packages consist of a stack of two Si dies attached with flip chip technology to a laminate in a ball grid array (BGA) configuration. Three packages were considered in this paper: two molded packages with different epoxy mold compounds (EMCs) and one bare die package without EMC. The impact of the bottom die thickness on the stress and package deformation is investigated. The finite element simulation results indicate that thinning the bottom die will cause larger stress and more warpage induced by packaging. Moreover, temperature hot spots cause larger stress and more deformation for thinner bottom dies. Furthermore, the results show that the stress and deformation caused by processing are much higher than those induced by temperature hot spots.
Keywords :
ball grid arrays; finite element analysis; flip-chip devices; integrated circuit packaging; resins; thermal stresses; three-dimensional integrated circuits; 3D IC package; 3D package; ball grid array configuration; bare die package; die thickness impact; epoxy mold compound; finite element modeling; flip chip technology; thermo-mechanical stress; warpage process; Copper; Electromagnetic compatibility; Mechanical factors; Reliability; Silicon; Temperature; Thermomechanical processes; 3D packaging; die thickness; finite element analysis; hot spots; stress; warpage;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
DOI :
10.1109/EuroSimE.2015.7103104
