DocumentCode :
2641722
Title :
Benchmark structures for modeling and measurement of electronic packaging
Author :
Tripathi, Vaibhav
Author_Institution :
Oregon State University, Corvailis, OR
fYear :
1992
fDate :
22-24 Apr 1992
Firstpage :
65
Lastpage :
65
Keywords :
Electronics packaging; Frequency; Integrated circuit interconnections; Large scale integration; Measurement standards; Millimeter wave circuits; Millimeter wave measurements; Millimeter wave technology; Ultra large scale integration; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1992
Print_ISBN :
0-7803-0683-X
Type :
conf
DOI :
10.1109/EPEP.1992.572266
Filename :
572266
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2641722
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