DocumentCode
2641808
Title
A highly integrated dual-band SiGe power amplifier that enables 256 QAM 802.11ac WLAN radio front-end designs
Author
Huang, Chun-Wen Paul ; Antognetti, Philip ; Lam, Lui ; Quaglietta, Tony ; Doherty, Mark ; Vaillancourt, William
Author_Institution
Skyworks Solutions, Inc., Andover, MA, USA
fYear
2012
fDate
17-19 June 2012
Firstpage
225
Lastpage
228
Abstract
A highly integrated SiGe BiCMOS PA is presented that enables the emerging high throughput 802.11ac WLAN applications. The PA has two stages for the g-band and three stages for the a-band PA, and integrates matching circuitry, out of band rejection filters, power detectors, and bias controls in a 1.5 ×1.6 mm chip. The g-band PA achieves 28 dB gain with 2% EVM at 18 dBm and 3% at 19.5 dBm output power. The a-band PA achieves 32 dB gain with 2% EVM at 18 dBm and 3% EVM at 19 dBm output power. The design is verified meeting not only the regulatory out-of-band emission requirements but also the linearity requirement of the emerging 256 QAM 802.11ac standard.
Keywords
BiCMOS analogue integrated circuits; Ge-Si alloys; MMIC amplifiers; UHF integrated circuits; UHF power amplifiers; band-stop filters; quadrature amplitude modulation; semiconductor materials; wireless LAN; 256QAM 802.11ac WLAN radio front-end designs; G-band; PA A-band; SiGe; band rejection filters; bias controls; gain 28 dB; gain 32 dB; highly integrated BiCMOS PA; highly integrated dual-band power amplifier; power detectors; Detectors; Dual band; Linearity; Power amplifiers; Power generation; Silicon germanium; Wireless LAN; WLAN 802.11ac high throughput power amplifier; dual-band PA; dual-band front-end module;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits Symposium (RFIC), 2012 IEEE
Conference_Location
Montreal, QC
ISSN
1529-2517
Print_ISBN
978-1-4673-0413-9
Electronic_ISBN
1529-2517
Type
conf
DOI
10.1109/RFIC.2012.6242269
Filename
6242269
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