Title :
Techniques for electromagnetic modeling and simulation of electronic packages - a review
Author_Institution :
Electromagnetic Communication Laboratory, University of Illinois, Urbana, IL 61801-2991
Keywords :
Circuit simulation; Computational modeling; Computer simulation; Distributed parameter circuits; Electromagnetic modeling; Electronics packaging; Integrated circuit interconnections; Microstrip; Stripline; Transmission line discontinuities;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1992
Print_ISBN :
0-7803-0683-X
DOI :
10.1109/EPEP.1992.572267
