Chip-package co-design of a 4.7 GHz VCO

Wireless communication applications require low-power and highly integrated transceiver solutions. In particular, the integration of the RF front-end poses a great challenge in these applications, as traditional front-end implementations require a large number of external passive components. "Single-package" integration of complete transceivers based on an MCM-D technology with integrated passives is presented in this paper as a superior alternative to overcome the many problems of single-chip CMOS integration. To benefit from all the advantages offered by this approach, a careful co-design of ICs and package is required. This is illustrated with the design of a 4.7 GHz VCO for a 5.2 GHz HIPERLAN-2 application.