Chip-package co-design of a 4.7 GHz VCO

Author

Donnay, Stephane ; Vaesen, Kristof ; Pieters, Philip ; Diels, Wim ; Wambacq, Piet ; De Raedt, Walter ; Beyne, Eric ; Engels, Marc ; Bolsens, Ivo

Author_Institution

IMEC, Leuven, Belgium

fYear

1999

fDate

22-24 Nov. 1999

Firstpage

145

Lastpage

148

Abstract

Wireless communication applications require low-power and highly integrated transceiver solutions. In particular, the integration of the RF front-end poses a great challenge in these applications, as traditional front-end implementations require a large number of external passive components. "Single-package" integration of complete transceivers based on an MCM-D technology with integrated passives is presented in this paper as a superior alternative to overcome the many problems of single-chip CMOS integration. To benefit from all the advantages offered by this approach, a careful co-design of ICs and package is required. This is illustrated with the design of a 4.7 GHz VCO for a 5.2 GHz HIPERLAN-2 application.

Keywords

integrated circuit design; integrated circuit packaging; multichip modules; transceivers; voltage-controlled oscillators; wireless LAN; 4.7 GHz; 5.2 GHz; HIPERLAN-2 application; IC/package co-design; MCM-D technology; RF front-end integration; VCO chip-package co-design; VCO design; external passive components; front-end implementation; integrated passives; integrated transceiver; single-chip CMOS integration; single-package integration; transceivers; wireless communication applications; Band pass filters; CMOS process; CMOS technology; Costs; Inductors; Integrated circuit technology; Packaging; Radio frequency; Transceivers; Voltage-controlled oscillators;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics, 1999. ICM '99. The Eleventh International Conference on

Print_ISBN

0-7803-6643-3

Type

conf

DOI

10.1109/ICM.2000.884826

Filename

884826