DocumentCode :
2642572
Title :
IC packages capacitance calculations using finite element method
Author :
Chou, Tai-Yu ; Cendes, Zoltan J.
Author_Institution :
Ansoft Corporation, Pittsburgh, PA 15219
fYear :
1992
fDate :
22-24 Apr 1992
Firstpage :
76
Lastpage :
78
Keywords :
Capacitance; Central Processing Unit; Finite difference methods; Finite element methods; Geometry; Integrated circuit interconnections; Integrated circuit packaging; Plastic integrated circuit packaging; Poisson equations; Sparse matrices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1992
Print_ISBN :
0-7803-0683-X
Type :
conf
DOI :
10.1109/EPEP.1992.572270
Filename :
572270
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2642572
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