DocumentCode :
2642656
Title :
Characterization and modeling of enhanced voltage RF MESFETs on 45nm CMOS for RF applications
Author :
Wilk, Seth J. ; Ghajar, M. Reza ; Lepkowski, William ; Bakkaloglu, Bertan ; Thornton, Trevor J.
Author_Institution :
Arizona State Univ., Tempe, AZ, USA
fYear :
2012
fDate :
17-19 June 2012
Firstpage :
413
Lastpage :
416
Abstract :
Enhanced voltage silicon metal-semiconductor-field-effect-transistors (MESFETs) have been fabricated on a 45 nm SOI CMOS technology with no process changes. MESFETs scaled to Lg = 184 nm were fabricated and show a peak fT of 35 GHz, current drive of 112 mA/mm and breakdown voltages exceeding 4.5 V whereas the nominal CMOS voltage was less than 1V on the same process. The devices were characterized from DC to 40 GHz and an industry standard TOM3 model has been developed describing their operation. A board level Class AB power amplifier operating at 433 MHz was designed, fabricated and measured to have a peak output power of 17 dBm and peak PAE of 42.5%. The supply voltage of the PA was more than twice the breakdown voltage of corresponding CMOS on the same semiconductor process. The measured PA results were used to validate the model across different bias and input power level conditions.
Keywords :
CMOS integrated circuits; Schottky gate field effect transistors; UHF integrated circuits; UHF power amplifiers; elemental semiconductors; integrated circuit design; semiconductor device models; silicon; silicon-on-insulator; MESFET voltage enhancement; RF MESFET characterization; RF MESFET modeling; SOI CMOS technology; board-level Class AB power amplifier; breakdown voltage; current drive; efficiency 42.5 percent; frequency 433 MHz; industry standard TOM3 model; semiconductor process; silicon metal-semiconductor field effect transistors; size 184 nm; size 45 nm; voltage 4.5 V; CMOS integrated circuits; Integrated circuit modeling; Logic gates; MESFETs; Power amplifiers; Radio frequency; Semiconductor device modeling; MESFETs; power amplifiers; semiconductor device modeling; silicon-on-insulator technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio Frequency Integrated Circuits Symposium (RFIC), 2012 IEEE
Conference_Location :
Montreal, QC
ISSN :
1529-2517
Print_ISBN :
978-1-4673-0413-9
Electronic_ISBN :
1529-2517
Type :
conf
DOI :
10.1109/RFIC.2012.6242311
Filename :
6242311
Link To Document :
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