Title :
Electromagnetic modeling of electronics packaging by the time-domain finite-difference method
Author_Institution :
Department of Electrical Engineering, State university of New York at Binghamton, Binghamton, NY 13902-6000
Keywords :
Boundary conditions; Coupling circuits; Electromagnetic modeling; Electromagnetic propagation; Electronics packaging; Finite difference methods; Frequency dependence; Integrated circuit interconnections; Strips; Time domain analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1992
Print_ISBN :
0-7803-0683-X
DOI :
10.1109/EPEP.1992.572274
