Title :
A MCM-L package with LCP core for millimeter-wave active integrated antennas
Author :
Merkle, T. ; Smith, S.
Author_Institution :
ICT Centre, CSIRO, Epping, NSW, Australia
Abstract :
A laminated multi-chip module (MCM-L) process has been developed with focus on integrating planar antennas and monolithic microwave integrated circuits (MMICs) at E-band (71-86 GHz). The antenna and interconnection substrate is composed of liquid crystal polymer (LCP). Edge-fed patch antennas on GaAs and slot-coupled antennas that couple from a GaAs chip to a patch antenna on LCP are presented. The edge-fed antenna can also be used to couple to a secondary patch on an LCP board located above the chip.
Keywords :
MMIC; liquid crystal polymers; microstrip antennas; millimetre wave devices; multichip modules; planar antennas; slot antennas; LCP; MCM-L package; edge-fed patch antennas; laminated multi-chip module; liquid crystal polymer; millimeter-wave active integrated antennas; monolithic microwave integrated circuits; planar antennas; slot-coupled antennas; Coupling circuits; Gallium arsenide; Integrated circuit interconnections; Integrated circuit packaging; MMICs; Microwave integrated circuits; Millimeter wave integrated circuits; Monolithic integrated circuits; Patch antennas; Planar arrays;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2009. APSURSI '09. IEEE
Conference_Location :
Charleston, SC
Print_ISBN :
978-1-4244-3647-7
DOI :
10.1109/APS.2009.5171487
