Title :
Analysis and optimization of differential PCB traces
Author :
Xu, Buli ; Tang, Sungyen ; Chen, Yinchao ; McDonough, Tom
Author_Institution :
Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC, USA
Abstract :
High-speed data transmission can suffer significant degradation after the signal has passed through a long transmission path. Proper design of PCB differential transmission pairs is one of the most important steps in creating a reliable serial ATA link. Based on a typical Intel 8-layer stackup, a design of 100 Omega microstrip and stripline differential pairs using empirical formulas and a 3D full-wave field solver is outlined in this paper.
Keywords :
microstrip lines; printed circuits; transmission lines; 3D full-wave field solver; Intel 8-layer stackup; differential PCB traces; empirical formulas; high-speed data transmission; microstrip differential pairs; resistance 10 ohm; serial ATA link; stripline differential pairs; Data communication; Degradation; Dielectrics; Frequency estimation; Impedance; Microstrip; Routing; Signal analysis; Stripline; Transmission lines;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2009. APSURSI '09. IEEE
Conference_Location :
Charleston, SC
Print_ISBN :
978-1-4244-3647-7
DOI :
10.1109/APS.2009.5171510
