• DocumentCode
    2643890
  • Title

    Enhancement of data retention and write current scaling for sub-20nm STT-MRAM by utilizing dual interfaces for perpendicular magnetic anisotropy

  • Author

    Jeong-Heon Park ; Kim, Youngjae ; Lim, W.C. ; Kim, Ji H. ; Park, Sang Ho ; Kim, Ji H. ; Kim, Wonhee ; Kim, Kwan Weon ; Jeong, J.H. ; Kim, Kwang Soon ; Kim, Heonhwan ; Lee, Y.J. ; Oh, S.C. ; Lee, J.E. ; Park, S.O. ; Watts, S. ; Apalkov, D. ; Nikitin, V. ;

  • Author_Institution
    Semicond. R&D Center, Samsung Electron. Co., Ltd., Hwasung, South Korea
  • fYear
    2012
  • fDate
    12-14 June 2012
  • Firstpage
    57
  • Lastpage
    58
  • Abstract
    We investigate the sub-20nm level scalability of STT-MRAM cells possessing perpendicular magnetization induced from the interface of free layer (FL) and MgO tunnel barrier. We demonstrate that the MTJs utilizing dual interfaces of FL and MgO exhibit enhanced scalability with high thermal stability and low switching current, compared with the MTJs with a single interface. As thermal stability factor (Δ) varies as a function of MTJ dimension, MTJs with dual interfaces show Δ over 60 at 20nm node, while MTJs of single interface show Δ around 33. MTJs with dual interface also exhibit lower switching current per thermal stability (Ic/Δ), ~1/2 level of single interface MTJs.
  • Keywords
    MRAM devices; magnesium compounds; magnetic anisotropy; thermal stability; MTJ; MgO; MgO tunnel barrier; data retention enhancement; dual interface; free layer; perpendicular magnetic anisotropy; perpendicular magnetization; size 20 nm; sub-20nm STT-MRAM; sub-20nm level scalability; switching current; thermal stability factor; write current scaling enhancement; Current measurement; Magnetic tunneling; Scalability; Stability analysis; Switches; Thermal factors; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSIT), 2012 Symposium on
  • Conference_Location
    Honolulu, HI
  • ISSN
    0743-1562
  • Print_ISBN
    978-1-4673-0846-5
  • Electronic_ISBN
    0743-1562
  • Type

    conf

  • DOI
    10.1109/VLSIT.2012.6242459
  • Filename
    6242459