Title :
Highly scalable STT-MRAM with 3-dimensional cell structure using in-plane magnetic anisotropy materials
Author :
Lee, Sungchul ; Kim, Kwangseok ; Kim, Keewon ; Pi, Unghwan ; Jang, Youngman ; Chung, U-In ; Yoo, Inkyung ; Kim, Kinam
Author_Institution :
Samsung Adv. Inst. of Technol. (SAIT), Yongin, South Korea
Abstract :
Novel spin transfer torque MRAM cells with three dimensional freelayer structures were suggested for the high density memory below 20nm technology node. By folding the freelayer to a special geometry, the 3D MTJ Cell structure retains large freelayer volume without an increase of cell foot-print, scaling down the MRAM cells even with in-plane magnetic anisotropy materials. From the micromagnetic calculation with Nudged Elastic Band (NEB) method, we confirmed the thermal stability over 60 in 3D MTJ cell with 15×30 nm2 area.
Keywords :
MRAM devices; magnetic anisotropy; magnetic materials; micromagnetics; thermal stability; 3-dimensional cell structure; 3D MTJ cell structure; MRAM cells; high density memory; highly scalable STT-MRAM; in-plane magnetic anisotropy materials; micromagnetic calculation; nudged elastic band; spin transfer torque; thermal stability; three dimensional freelayer structures; Energy barrier; Magnetic anisotropy; Magnetic tunneling; Magnetization; Micromagnetics; Switches; Thermal stability; 3D MTJ Cell; MRAM; NEB; thermal stability;
Conference_Titel :
VLSI Technology (VLSIT), 2012 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4673-0846-5
Electronic_ISBN :
0743-1562
DOI :
10.1109/VLSIT.2012.6242463